TN14/TN140 NOZZLE

J7055131C J7055131E J7055131-O J90551054A J9055072C TN14/TN140 NOZZLE FOR Samsung NOZZLE

Brand Name：Samsung

Product name：Nozzle

Model Number：

J7055131C TN14/TN140 NOZZLE

J7055131E TN14/TN140 NOZZLE

J7055131-O TN14/TN140 NOZZLE

J90551054A TN14/TN140 NOZZLE

J9055072C TN14/TN140 NOZZLE

Condition:original new/compatible new/used original

Lead time:1-3 Days

MOQ : 1 PCS

Surface Mount Device (SMD) and Surface Mount Technology (SMT) are terms often used interchangeably, but they refer to different aspects of the electronic component assembly process.

1.Surface Mount Device (SMD):

  -Definition:SMD refers to the electronic components themselves, such as resistors, capacitors, diodes, and integrated circuits, that are designed to be mounted directly onto the surface of a printed circuit board (PCB) without the need for leads or through-holes.

  -Characteristics:SMDs are characterized by their compact size, flat profile, and the absence of traditional wire leads. They typically have small, flat, and solderable contact points on their bodies, allowing them to be soldered directly onto the surface of the PCB.

2.Surface Mount Technology (SMT):

  -Definition:SMT refers to the overall process of assembling electronic components onto the surface of a PCB without the use of traditional through-hole components. It encompasses the entire manufacturing process, including the placement and soldering of SMDs.

  -Process:In SMT, electronic components are mounted directly onto the surface of the PCB using techniques such as pick-and-place machines and soldering methods like reflow soldering. The goal is to create a compact and lightweight assembly that is suitable for modern electronic devices.

In summary, SMD refers to the individual electronic components designed for surface mounting, while SMT refers to the overall technology and process of assembling these components onto a PCB. SMT includes the placement and soldering of SMDs, along with other processes involved in modern PCB assembly.

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