GSM3708
GS
Availability: | |
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8mm ESD SMT Splice Tape For Automatic Splicing Machine
Brand Name :GS
Material: PET
Model Number:GSM3708
Dimensions (pc):14mm x 32mm
Product name:Reel Type splice tape
Application:SMT process
Customization:Support
Lead time:1-3 Days
一、Product Composition and Design
The GSM3708 splice tape is composed of several key elements that contribute to its effectiveness and ease of use:
1.Adhesive Tapes: The core component that ensures strong bonding between the carrier tapes.
2.Transparent Release Film: Facilitates easy handling and application by protecting the adhesive layer until use.
3.Removable PET Backing: Adds structural integrity and makes the tape easy to manage during the splicing process.
二、Applications
1.Automatic Splicing Machines: The tape is ideal for use with automatic splicing machines, providing high jointing efficiency and ensuring smooth operation without manual intervention.
2.4mm Carrier Tapes: While it is highly versatile, the GSM3708 splice tape is especially suited for 4mm carrier tapes.
3.Customization Options: Recognizing the diverse needs of modern manufacturing, the GSM3708 splice tape can be customized to meet specific requirements, ensuring it fits perfectly into any production setup.
三、Instructions for Use
1.Cutting the Carrier Tapes: Use a precision cutting tool to accurately cut the carrier tapes to the desired length. Ensuring clean and precise cuts is crucial for achieving a strong and reliable joint.
2.Preparing the Splice Tape: Carefully remove the release liner from the splice tape to expose the adhesive side. This step is important for ensuring that the adhesive is ready to bond with the carrier tapes.
3.Positioning the Carrier Tapes: Align the ends of the carrier tapes and place them onto the first strip of the splice tape. Accurate alignment is essential for creating a seamless joint that will not disrupt the automated process.
4.Securing the Joint: After positioning the carrier tapes, press the splice tape firmly at various points along the tapes. This ensures a secure and durable bond, capable of withstanding the stresses of the SMT process.
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